Welcome to Speed Assembly Services (SAS)

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Our PCB Manufacturing, Surface Mount and Through Hole Soldering Capabilities


Feature Capability
Size
Minimum 6mm x 6mm
Maximum 400mm x 400mm
Number of Layers 1 / 2 / 4 / 6
Material FR-4 Tg 140C
Finish ENIG-RoHS
PCB Thickness
1 Layer - - 0.8mm 1.0mm 1.2mm 1.6mm 2.0mm
2 Layers 0.4mm 0.6mm 0.8mm 1.0mm 1.2mm 1.6mm 2.0mm
4 Layers - - 0.8mm 1.0mm 1.2mm 1.6mm 2.0mm
6 Layers - - - - 1.2mm 1.6mm 2.0mm
Resist Colour Green / Red / Yellow / Blue / White / Black -- LPI (Liquid Photo Imageable)
Copper Weight
1 Layer 1oz (35µm) -
2 / 4 / 6 Layers 1oz (35µm) 2oz (70µm) -- PCB thickness must be 1.6mm or 2mm
Gold Fingers Supported if PCB bigger than 51mm x 51mm
Castellated Holes Not currently supported

Feature Capability Description / Notes
Stack-Up Default layer stack-up Available on request
Dimensions Tolerance
CNC Routing ±0.2mm
V-Scoring ±0.4mm
-
Thickness Tolerance (PCB ≥ 1.0mm) ±10% -
Thickness Tolerance (PCB < 1.0mm) ±0.1mm -
Finished Inner Layer Copper 0.5oz (17.5µm) -

Feature Minimum Maximum
Size 51mm x 51mm 400mm x 400mm
Thickness 0.8mm 3.2mm
Borders or No Components to Edge 10mm -
Parallel and Symmetrical Edges 2 -
  • • SAS will not be responsible for any incompatibilities of the PCB finish with the assembly technology (example: HASL for fine pitch or BGA), impacting the quality of the assembly.
  • • Failure to comply with these constraints may require the production of tools, which will be billed to you directly and the cost of which will be specified to you upon receipt of your PCB.

Feature Capability Description / Notes
Drill Hole Size
Minimum 0.20mm
Maximum 6.30mm
-
Drill Hole Size Tolerance +0.13mm
-0.08mm
-
Blind / Buried Vias Not supported -
Minimum Via Hole Size
1 / 2 Layers 0.3mm
4 / 6 Layers 0.2mm
-
Minimum Via Diameter
1 / 2 Layers 0.6mm
4 / 6 Layers 0.4mm
-
Plated Through Hole (PTH) Size
Minimum 0.20mm
Maximum 6.35mm
The annular ring size will be enlarged 0.15mm in production
Pad Size
Minimum 0.70mm
Maximum 6.35mm
The pad hole size will be enlarged 0.15mm in production
Minimum Non-Plated Through Holes (NPTH) 0.50mm Please add NPTH to the mechanical layer or keep out layer
Minimum Plated Slot Width 0.65mm -
Minimum Non-Plated Slot Width 1.0mm Please draw the slot outline in the mechanical layer or keep out layer
Hole size Tolerance (Plated) +0.13mm
-0.08mm
-
Hole size Tolerance (Non-Plated) ±0.2mm -
Rectangular Hole/Slot Not supported Any rectangular holes or slots will be made round or oval

Copper Weight Minimum Annular Ring Plated Through Hole (PTH)
1oz 0.13mm 0.3mm
2oz 0.2mm 0.3mm

Features Capabilities
Hole to Hole Clearance (Different Nets) 0.5mm
Via to Via Clearance (Same Nets) 0.254mm
Pad to Pad Clearance (Pad without Hole, Different Nets) 0.127mm
Pad to Pad Clearance (Pad with Hole, Different Nets) 0.5mm
Via to Track 0.254mm
Plated Through Hole (PTH) to Track 0.33mm
Non-Plated Through Hole (NPTH) to Track 0.254mm
Pad to Track 0.2mm

Minimum Trace Width / Minimum Spacing
1 / 2 Layers 5mil (0.127mm)
4 / 6 Layers 3.5mil (0.09mm)
2oz Copper Weight 8mil (0.2mm)

Layer Count Minimum BGA Pad Dimensions Minimum Distance Between BGA
1 / 2 Layers 0.4mm 0.127mm
4 / 6 Layers 0.25mm 0.127mm

Feature Capability Description / Notes
Solder Mask Opening / Expansion 0.05mm Minimum growth/mask opening around the pad to allow for any mis-registration
Minimum Distance between Pads to Apply Solder Mask Dam
Green 0.2mm (8mils)
Other Colours 0.254mm (10mils)
-
Solder Mask Dielectric Constant 3.8 -
Solder Mask Thickness 10-15µm -

Feature Capability Description / Notes
Minimum Line Width 6mil (0.153mm) Characters width less than 6mil (0.153mm) will be unidentifiable
Minimum Text Height 40mil (1.0mm) Characters height less than 40mil (1.0mm) will be unidentifiable
Character Width to Height Ratio 1:6 Optimal
Pad To Silkscreen Minimum Distance 0.15mm -

Feature Minimum
Trace to Outline 0.2mm
Trace to V-Cut Line 0.4mm

* We do support both through hole and surface mount mixed assembly.