SAS PCB
Where Quality Meets Innovation in PCB Assembly
| Feature | Capability | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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| Size |
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| Number of Layers | 1 / 2 / 4 / 6 / 8 / 10 / 12 / 14 / 16 / 18 / 20 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Material | FR-4 Tg 140C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Finish | ENIG-RoHS | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| PCB Thickness |
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| Resist Colour | Green / Red / Yellow / Blue / White / Black / Purple -- LPI (Liquid Photo Imageable) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Copper Weight |
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| Gold Fingers | Supported if PCB bigger than 51mm x 51mm | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| Castellated Holes | Currently supported for panels |
| Feature | Capability | Description / Notes | ||||
|---|---|---|---|---|---|---|
| Stack-Up | Default layer stack-up | Available on request | ||||
| Dimensions Tolerance |
|
- | ||||
| Thickness Tolerance (PCB ≥ 1.0mm) | ±10% | - | ||||
| Thickness Tolerance (PCB < 1.0mm) | ±0.1mm | - | ||||
| Finished Inner Layer Copper | 0.5oz (17.5µm) | - |
| Feature | Minimum | Maximum |
|---|---|---|
| Size | 51mm x 51mm | 400mm x 400mm |
| Thickness | 0.8mm | 3.2mm |
| Borders or No Components to Edge | 10mm | - |
| Parallel and Symmetrical Edges | 2 | - |
| Feature | Capability | Description / Notes | ||||
|---|---|---|---|---|---|---|
| Drill Hole Size |
|
- | ||||
| Drill Hole Size Tolerance | +0.13mm -0.08mm |
- | ||||
| Blind / Buried Vias | Not supported | - | ||||
| Minimum Via Hole Size |
|
- | ||||
| Minimum Via Diameter |
|
- | ||||
| Plated Through Hole (PTH) Size |
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The annular ring size will be enlarged 0.15mm in production | ||||
| Pad Size |
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The pad hole size will be enlarged 0.15mm in production | ||||
| Minimum Non-Plated Through Holes (NPTH) | 0.50mm | Please add NPTH to the mechanical layer or keep out layer | ||||
| Minimum Plated Slot Width | 0.65mm | - | ||||
| Minimum Non-Plated Slot Width | 1.0mm | Please draw the slot outline in the mechanical layer or keep out layer | ||||
| Minimum Castellated Holes | 0.60mm |
A castellated pad includes a plated half-hole on the edge of a board, usually used on daughter PCB modules to solder to carrier boards.
• Hole diameter ≥ 0.6 mm • Hole to board edge ≥ 1 mm • Minimum board size 10 × 10 mm |
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| Panelized castellated holes board | Panelize with stamp holes and add tooling strips on four board edges |
The distance between castellated hole and board corner should be larger than 2mm.
Recommended diameter of stamp hole is 0.5mm-0.8mm; Recommended distance between the two stamp holes is 0.2-0.3mm |
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| Hole size Tolerance (Plated) | +0.13mm -0.08mm |
- | ||||
| Hole size Tolerance (Non-Plated) | ±0.2mm | - | ||||
| Rectangular Hole/Slot | Not supported | Any rectangular holes or slots will be made round or oval |
| Copper Weight | Minimum Annular Ring | Plated Through Hole (PTH) |
|---|---|---|
| 1oz | 0.13mm | 0.3mm |
| 2oz | 0.2mm | 0.3mm |
| Features | Capabilities |
|---|---|
| Hole to Hole Clearance (Different Nets) | 0.5mm |
| Via to Via Clearance (Same Nets) | 0.254mm |
| Pad to Pad Clearance (Pad without Hole, Different Nets) | 0.127mm |
| Pad to Pad Clearance (Pad with Hole, Different Nets) | 0.5mm |
| Via to Track | 0.254mm |
| Plated Through Hole (PTH) to Track | 0.33mm |
| Non-Plated Through Hole (NPTH) to Track | 0.254mm |
| Pad to Track | 0.2mm |
| Minimum Trace Width / Minimum Spacing | |
|---|---|
| 1 / 2 Layers | 5mil (0.127mm) |
| 4+ Layers | 3.5mil (0.09mm) |
| 2oz Copper Weight | 8mil (0.2mm) |
| Layer Count | Minimum BGA Pad Dimensions | Minimum Distance Between BGA |
|---|---|---|
| 1 / 2 Layers | 0.4mm | 0.127mm |
| 4+ Layers | 0.25mm | 0.127mm |
| Feature | Capability | Description / Notes | ||||
|---|---|---|---|---|---|---|
| Solder Mask Opening / Expansion | 0.05mm | Minimum growth/mask opening around the pad to allow for any mis-registration | ||||
| Minimum Distance between Pads to Apply Solder Mask Dam |
|
- | ||||
| Solder Mask Dielectric Constant | 3.8 | - | ||||
| Solder Mask Thickness | 10-15µm | - |
| Feature | Capability | Description / Notes |
|---|---|---|
| Minimum Line Width | 6mil (0.153mm) | Characters width less than 6mil (0.153mm) will be unidentifiable |
| Minimum Text Height | 40mil (1.0mm) | Characters height less than 40mil (1.0mm) will be unidentifiable |
| Character Width to Height Ratio | 1:6 | Optimal |
| Pad To Silkscreen Minimum Distance | 0.15mm | - |
| Feature | Minimum |
|---|---|
| Trace to Outline | 0.2mm |
| Trace to V-Cut Line | 0.4mm |